The IVB7 engineers have engineered this device with the utmost passion to bring the utmost unique bonding device to the rapidly evolving market of technology. Each piece of hardware of this device is made with keen attention to the device’s work frame to outbreak the low bandwidth and slow network issues. The inbuilt hardware materials increase the efficiency of the wireless bonding device. Various technologies such as 7Edge Technology, Super Cooling Technology, and Ripeflow Technology are built into the product.